Designed for very high temperature masking applications.  Ideal for masking the gold fingers on printed circuit boards during the wave solder process.

Used on gold fingers for protection in wave soldering or where used as ground barrier and phase insulation in high performance torroidal coils.

Polyimide backing and high tack acrylic adhesive offers excellent chemical and thermal resistance with excellent electrical insulating properties. This product is used where toughness and puncture resistance are required.

K-859 consists of polyimide film and acrylic adhesive designed for die-cut high temperature masking dots. Used for protection of printed circuit boards during wave soldering. K-859 is also used in electrical insulation applications meeting class H requirements.

K-845 consists of a polyimide film and silicone adhesive designed for high temperature masking applications, including the protection of printed circuit board gold finger contacts during wave soldering, It is used in electrical insulation applications meeting class H requirements.

Designed for very high temperature masking applications.  Ideal for use in powder coat applications and for masking printed circuit boards during various production processes.  Also suitable for splicing applications.

Designed for splicing silicone coated papers and films.  K-280 is also ideal for masking printed circuit boards during the plating process.

Designed for maximum performance in composite bonding, masking, and silicone web splicing applications.

Designed for use in masking applications for electronic component and printed circuit board production.