IPG® RA6 is a high-temperature, bi-directional filament tape constructed with a smooth crepe paper backing reinforced with fiberglass and coated with a natural rubber/resin adhesive.
Engineered for demanding industrial environments, it provides strong adhesion, excellent shear resistance, and reliable splicing performance under continuous web tension.
Designed to withstand temperatures up to 400°F (204°C), it is ideal for high-temperature splicing applications in flooring, abrasives, and heavy material processing industries.