K-837 is a high-performance copper foil tape designed for EMI/RFI shielding, grounding, and conductive applications requiring low electrical resistance and strong adhesion.
Constructed with 1 oz rolled copper foil and a conductive acrylic adhesive system, it provides excellent solderability and reliable electrical conductivity through the adhesive layer.
Engineered for precision electronic applications, K-837 is ideal for shielding cables, sealing seams in shielded enclosures, PCB repair, and static-sensitive packaging where conductivity and performance are critical.